Chip-on-Board Solutions

Please send Your target specifications regarding CoB to sales@epigap-optronic.de. Epigap offers You the development and production of Chip on Board assemblies as follows:

1. materials of CoB
1.1. FR4 (flame retardant), epoxy lamiinate Isolas IS410
1.2. silicon carrier
1.3. Al-core printed circuit board (PCB)
1.4. Cu-core PCB

2. size to 140 x 140 mm² (larger on request)

3. number of layers inside the PCB
3.1. normally 2 - 8 layers
3.2. possible up to 32 layers

4. position accuracy of dice on PCB: ±50 microns (more exactly on request)

5. power density up to 16 W/cm² (with water cooling)

6. protecting cover
6.1. overmoulding (epoxy or silicone)
6.2. glass plate
6.3. filter glass

7. cooling
7.1. by air
7.2. water cooling

8. driver electronics can be integrated onto the PCB

9. component types on CoB
9.1. light-emitting diodes (LEDs)
9.2. photodiodes (PDs)
9.3. application-specific integrated circuits (ASICs)
9.4. thermistors
9.5. protection diodes
9.6. hybrid circuits (chips, surface-mount devices - SMDs) possible
other

10. final control
10.1. electrical measurements
10.2. optical measurements